Thermal Grizzly Minus Pad 8 Thermal Pad (100x100x1.5mm)

This Thermal Pad (100 × 100 × 1.5 mm) is a high-performance thermal interface material designed to bridge larger gaps between heat-generating components and their heatsinks. With a conductivity value of 8 W/mK, rating of 8 W/mK, it enables dispersal of heat away from components like a CPU , GPU memory modules, VRMs, MOSFETs, chipsets, and SSD controllers to cooling solutions. The generous 100 × 100 mm sheet size allows users to cut custom sections for multiple applications, while the thicker 1.5 mm profile makes it ideal for situations where greater spacing must be filled without compromising thermal efficiency. This makes it especially useful in graphics cards, motherboards, gaming consoles, and other devices where component height differences require a thicker thermal pad.

Manufactured from a ceramic silicone-based compound enhanced with nano aluminum oxide particles, the pad combines strong thermal performance with long-term durability. It remains stable under multiple temperature fluctuations, resisting drying, cracking, or oil separation over time. The material is soft and compressible, allowing it to conform to uneven surfaces and ensure consistent contact pressure for optimal heat transfer. Additionally, it is electrically non-conductive and non-capacitive, minimizing the chance of short circuits during installation. The 1.5 mm thickness provides reliable gap filling for demanding cooling setups, making it a dependable solution for enthusiasts, system builders, and repair professionals seeking consistent and maintenance-free thermal performance.

Key Features

Strong Heat Dissipation (8 W/mK)
With a thermal transfer value of 8 W/mK, this thermal pad efficiently moves heat from components such as GPU memory, VRMs, MOSFETs, chipsets, and SSD controllers, helping maintain stable and safe operating temperatures

Thick 1.5 mm Gap Filling
The 1.5 mm thickness is ideal for bridging larger gaps between hardware and cooling surfaces. It ensures proper contact and pressure in setups where height differences must be compensated without reducing cooling efficiency.

Large 100 × 100 mm Sheet
The generous sheet size allows users to cut and customize the pad according to specific requirements. A single sheet can be trimmed into multiple pieces for different components, offering flexibility and value.

Durable Ceramic Silicone Material
Made from a ceramic silicone-based compound with nano aluminum oxide, the pad provides stable, long-lasting performance. It resists drying, cracking, and oil separation even after prolonged use.

Flexible and Compressible Structure
Its soft and adaptable design helps to conform to uneven surfaces, improving surface contact and enhancing overall thermal transfer performance.

Electrically Non-Conductive
This pad is electrically insulating and non-capacitive, minimizing the chance of short circuits during installation and making it safe for use near delicate electronics.

Technical Specification