Thermal Grizzly Minus Pad 8 Thermal Pad (30x30x1.5mm)

Minus Pad 8 (30 × 30 × 1.5 mm) serves as a thermal interface solution that helps to remove heat away from electronic components to heatsinks or cooling plates. By having its thermal conductivity rating of 8 W/mK, it ensures effective heat dissipation for components such as GPUs, VRMs, RAM modules, chipsets, and M.2 SSDs. The 1.5 mm thickness makes it particularly suitable for applications where there is a larger gap between the component and the heatsink, helping to maintain proper contact and mounting pressure. Its 30 × 30 mm square format provides enough surface area for medium-sized components and can also be trimmed to fit custom layouts.

Constructed from a ceramic silicone-based compound enhanced with nano aluminum oxide, this thermal pad offers stable, long-lasting thermal performance without drying out or degrading over time. The pad is highly compressible and flexible, allowing it to conform to uneven surfaces and eliminate air gaps that can reduce cooling efficiency. It is also electrically non-conductive, ensuring safe installation around sensitive circuitry. Easy to handle and apply, the pad requires only light pressure to achieve optimal placement, making it a reliable and user-friendly solution for both high-performance gaming systems and professional workstations.

Key Features   

High Thermal Performance (8 W/mK)

This thermal pad delivers strong transfer performance rated at 8 W/mK. It efficiently draws warmth away from hardware such as GPUs, VRMs, RAM, and SSD controllers, helping maintain stable operating temperatures under load.

1.5 mm Thickness for Larger Gaps

With its 1.5 mm thickness, this pad is ideal for applications where there is more space between the component and the heatsink. It ensures proper surface contact while maintaining correct mounting pressure and alignment.

Flexible and Highly Compressible Structure

The pad features a soft, elastic design that adapts to uneven surfaces. Its high compressibility allows it to fill microscopic gaps and eliminate air pockets, significantly improving thermal efficiency.

Electrically Insulating

This thermal pad is non-conductive, making it safe to use around sensitive electronic circuits. It reduces the risk of short circuits during installation, offering added reliability.

Compact 30 × 30 mm Size

The square 30 × 30 mm format is suitable for medium-sized chips and modules. It can also be easily trimmed to fit specific layouts or custom cooling solutions.

Durable Ceramic-Based Composition

Made from a ceramic silicone compound enhanced with nano aluminum oxide, the pad provides long-lasting performance without drying, cracking, or degrading over time.

Easy and Clean Installation

Unlike thermal paste, this pad requires no spreading. Simply cut to size if needed, remove the protective film, and apply with light pressure for secure placement and effective heat transfer.

Technical Specification