Thermal Grizzly Minus Pad 8 Thermal Pad (120x20x0.5mm)

The Thermal Grizzly Minus Pad series is designed to deliver efficient and reliable thermal transfer in applications where precise contact between components and heatsinks is critical. These performance-focused pads use a soft, adaptable material that conforms easily to uneven or textured component surfaces. By molding closely to these irregularities, the pads help eliminate tiny air pockets that could otherwise hinder effective heat transfer. With very high thermal conductivity, the pads ensure that heat generated by components such as GPUs, VRMs, RAM modules, SSDs, and chipsets is quickly transferred to the cooling solution. They are available in multiple sizes and thicknesses, making them suitable for different spacing requirements and hardware configurations.
Manufactured from an advanced ceramic-silicon blend, the pads use aluminum oxide micro-fillers to enhance performance. This material composition enables consistent and stable heat transfer over long periods without drying out or degrading. Their soft, easy-to-process structure allows users to cut them to the required shape and install them effortlessly—only light pressure is needed to secure proper contact. In addition, the pads are electrically insulating, providing safety when used near sensitive electronics. Being eco-friendly and RoHS-compliant, they meet strict environmental standards by limiting hazardous substances, making them both performance-focused and environmentally responsible.

Key Features   

High Thermal Conductivity (8 W/mK)
The Minus Pad 8 delivers strong thermal performance with a conductivity rating of 8 W/mK, enabling efficient heat transfer from components like VRMs, GPUs, RAM modules, and M.2 SSDs to heatsinks or cooling plates.

Extended Strip Size (120 × 20 mm)
This long, narrow format is ideal for covering extended surface areas such as voltage regulator modules, memory rows, or slim cooling assemblies. It reduces the need for multiple smaller pads and ensures uniform heat distribution.

Precision Thickness (0.5 mm)
With a 0.5 mm profile, the pad is suited for tight tolerances where accurate spacing is essential. It maintains proper mounting pressure while ensuring optimal thermal contact.

Highly Compressible and Flexible
The elastic structure allows the pad to conform to uneven surfaces, filling microscopic gaps and eliminating insulating air pockets. This improves thermal efficiency and contact reliability.

Electrically Insulating
The pad is non-conductive, reducing the risk of short circuits when installed near sensitive electronic components, making it safe for high-density PCBs.

Durable Ceramic-Based Composition
Constructed from a resilient ceramic-silicone blend, the Minus Pad 8 provides long-lasting thermal stability while resisting wear, cracking, and performance drop-off.

Easy to Cut and Install
The 120 × 20 mm strip can be trimmed to custom lengths for specific applications. Its soft texture allows for simple placement and secure contact with minimal pressure.

RoHS-Compliant and Eco-Friendly
Manufactured in compliance with RoHS standards, the pad is free from harmful substances and safe for long-term use in consumer and professional systems.

Technical Specification